Transcription of 環氧成型模料對構裝後晶片 ... - engh.kuas.edu.tw
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環氧成型模料對構裝後晶片 ... - engh.kuas.edu.tw
532 545 1 1 1 2 2 1 2 E-mail: (Epoxy Molding Compound; EMC) SOP8(150mil) EMC SEM EMC EMC SOP8(150mil) EMC MAR Glue-A SOP8-A Precondition Level III(30 C/60%/192hrs) SOP8-A TCT 1000cycles SOP8-A (EMC) 1. IC Integrated Circuit [1] IC [2] IC [3] 1. IC IC IC 2.
環氧成型模料對構裝後晶片可靠度的影響 533. 圖1-1 封裝製程流程. 半導體封裝材料的主要功能，在於避免晶片和連接訊號之金線受到物理的、化學的損壞（溫度、濕度、
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