環氧成型模料對構裝後晶片 ... - engh.kuas.edu.tw

1 532 545 1 1 1 2 2 1 2 E-mail: (Epoxy Molding Compound; EMC) SOP8(150mil) EMC SEM EMC EMC SOP8(150mil) EMC MAR Glue-A SOP8-A Precondition Level III(30 C/60%/192hrs) SOP8-A TCT 1000cycles SOP8-A (EMC) 1. IC Integrated Circuit [1] IC [2] IC [3] 1. IC IC IC 2.

2 IC IC 3. IC IC 85 C 4. IC IC IC IC IC 1-1 [4-5] Wafer Back Grinding Waf er Saw Die Attach Wire Bonding Molding Dejunk&Trim Solder Plating Forming&Singulation 2010 National Kaohsiung University of Applied Sciences, ISSN 1813-3851 533 1-1 IC [6] Epoxy Polyimide PI Phenolics Silicones [7]

3 A Bisphenol-A Novolacepoxy Cyclicaliphatic [8] -Creso-Novolac Epoxy Resin CNE Tg 150 C [9-10] Tab le 1-1 5~12% (Hardener) 1~7% 60%~90% (SiO2) 1-2 RoHS Sb2O3 (Coupling agent) (Silane) (Delamination) (Imidazole) Table 1-1 Wieght % (Epoxy) -Creso-Novolac 5~10 (Hardener) Phenol 5~10 (Flame Retardant) Br Sb2O3 10 (Filler) (SiO2) 60~90 (Catalyst) N P 1 (Coupling Agent) Silane 1 (Releasing) (Wax) 1 (Coloring Agent) 1 Wafer Grinding Wire Boding Wafer SawDie AttachMolding Dejunk&TrimSolder PlatingForming&Singul 534 1-2 (SiO2)

4 [11] Function Fail [12] 240 C 260 C [13] [14] [15] Bathtub Curve 1-2 Infaut Mortality Region Useful Life Region Wearout Region 48~106 [16] 1-3 Bathtub Curve 5352. (1) (Epoxy Molding Compound) EMC-A MAR 87% EMC-B Biphenyl EMC-C OCN Tab le 2-1 2-1~2-3 Table 2-1 (Green compound) EMC-A EMC-B EMC-C Multi-Aromatic MARB iphenyl Cresol Novolac OCN (wt%) 87 88 ( C) 110 115 110 1 (ppm/ C) 15 7 8 2(ppm/ C) 55 30 37 R1 OOHCOOR2n 2-1 EMC-A(MAR) OOH3CH3 CCH3CH3OO 2-2 EMC-B(Biphenyl)

5 536H3 COOH2CH3 COOH2CH3 COnO 2-3 EMC-C(OCN) (2) (Chip) (3) (Lead Frame) SOP8(150mil) Table 2-2 Table 2-2 Package SOP8(150mil) Item Package Lead Frame/ die pad(mm) Die size (mm) Glue EMC A Glue-A EMC-A B Glue-B EMC-B C SOP8 (150mil)

6 Glue-C EMC-B ( ) DSC Curing SEM EMC 2-4 ( ) Absorption De-sorption Reliability Test Level I Level II Level III SAT Check SAT Check IR Reflow Package 2-5 (Reliability test flow) IR260 C*3times SAT Inspection II Cross-Section F/T SEM TCT -65 C~+150 C 1000cycle TST -65 C~+150 C 200cycle PCT 121 C /100% HTSL 150 C 1000hrs HAST 130 C /85% SAT Inspection III Reliability Test Visual Check SAT Inspection I Level III 30 C/60%/192hrs Cross-Section TCT -65 C~+150 C/5cycle Baking 125 C/24hrs SEM 2-6 SEM (EMC) 24 hours EMC 175 C 5 hours EMC SiO2 ( ) Tab le2-3 Level I(85 oC/85%) Level II(85 oC/60%) Level III(30oC/60%) 500 IPO/JEDEC J-STD-020D 1.

7 SOP8(150mil) 10pcs a. (125 oC/24hours) b. (W0) c. 0/2/4/8/16/24/48/72/96/120/144/168/192/3 00/400/500 (Wt) =[(Wt)-(W0) (W0)] x 100 % ( ) Wt t W0 Table 2-3 Level Temperature (oC) Humidity (%) Time (Hour) I 85 85 500 II 85 60 500 III 30 60 500 2. Tab le 2-3 Level 125 C 0 / 2 / 4 / 8 / 16 / 24 ( ) EMC Package SOP8(150mil) (Reliability test) ( ) 1. SOP8(150mil) 40 2. SOP8(150mil) (Scanning Acoustic Tomography SAT) sample 75 MHz Compound chip inner lead and die pad 3. SOP8(150mil) (TCT) -65/15min ~ C +150/15min C -65 C 10 5 150 C 150 C 10 5 -65 C cycle 30 5cycles 5404.

8 125+5/-0 C 24hrs 5. Level III 30 C 60% 192hrs 15 4 6. JESD22-A113-F IR for 260+2/ C-0 C IR260 C 7. SAT 75 MHz Transducer Compound chip inner lead and die pad Cross-section SEM SOP8(150mil) (TCT) (TST) (PCT) (HTSL) (HAST) SOP8(150mil) (TCT) (TST) (PCT) (HTSL) (HAST) ( ) 1. (Temperature Cycling Tester, TCT)(Air to Air) SOP8(150mil) -65/15min ~ C +150/15min C -65 C 10 5 150 C 150 C 10 5 -65 C cycle 30 1000cycle SAT 2. (Thermal Cycling Tester, TST) (Liquid to Liquid) SOP8(150mil) -65/5min ~ C +150/5min C cycle 10 200cycle SAT 3.

9 ( Pressure Cook Test, PCT) SOP8(150mil) 121+/-1 C 100% 2atm 168 PCT 168 SAT Cross-section SEM 4. (High Temperature Storage Life, HTSL) SOP8(150mil) 150 C 1000 1000 SAT 5. (High Accelerated Stress Tester, HAST) SOP8(150mil) 130 C 85% 96 96 SAT ( ) SAT SAT JEDEC J-STD 020D precondition Level III(30/60%/192 C ) Tab le 2-4 ~ C ~ C ~ C ~ C SAT 541 Table 2-4 Type (/Sec) C ~ ~ ~ SOP8-A ~ 3. SEM EMC 3-1~3-3 EMC SiO2 (Spherical) CTE 3-1 SEM photo of EMC-A SiO2 3-2 SEM photo of EMC-B SiO2 3-3 SEM photo EMC-C SiO2 IC SOP8 85 oC/85%/500 85 oC/60%/500 30oC/60%/500 3-4~3-6 MAR SOP8-A OCN SOP8-C 3-4 85 oC/85% 3-5 85 oC/60% 3-6 30 oC/60% IC SOP8 125/24hrs C 3-7~3-9 4hrs 24hrs MAR SOP8-A 3-7 85 oC/85% 3-8 85 oC/60% 3-9 30 oC/60% (Reliability Test)

10 SOP8 SAT result MAR SOP8-A pass precondition level III Tab le 3-1 MAR SOP8-A CTE Reliability test (die pad) CTE (die pad delamination) cross-section m 15~50 m die pad delamination Biphenyl SOP8-B OCN SOP8-C precondition level III (inner lead) second bond crack glue layer compound lead frame gap JEDEC-020D EMC Table 3-1 SOP8 SAT result Unit:(pc) Before After TCT TST PCT HTSL HAST Type MSL3 MSL31000cycle200cycle168hrs1000hrs 96hrs Chip 0/20 0/200/20 0/20 0/20 0/20 0/20 Lead 0/20 0/200/20 0/20 0/20 0/20 0/20 SOP8-A Die Pad 0/20 0/2010/20 7/20 6/20 0/20 0/20 Chip 0/20 0/200/20 0/20 0/20 0/20 0/20 Lead 0/20 6/2013/20 16/20 14/20 7/20 12/20 SOP8-B Die Pad 0/20 0/2016/20 14/20 16/20 8/20 11/20 Chip