Transcription of Esec 2100 xPplus - Besi
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Esec 2100 xPplus - Besi
Esec 2100 xPplusThe Fastest 12 Epoxy Die BonderThe revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 m. Optionally, the accuracy can even be improved, down to 15 m. Minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder esec 2100 xpplus . Standard accuracy 20 m Optional 15 m accuracy (at highest speed) Fastest Time to Yield Highest uptime Flexible platform for all epoxy packagesProcess Quality for Highest YieldFuture Proof Equipment2nd GENERATION VISION SYSTEMCLEAN MACHINESTRIP THICKNESSCOMPENSATIONHIGH PRECIS
Esec 2100 xPplus The Fastest 12” Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 μm.
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