Esec 2100 xPplus - Besi

1 Esec 2100 xPplusThe Fastest 12 Epoxy Die BonderThe revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 m. Optionally, the accuracy can even be improved, down to 15 m. Minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder esec 2100 xpplus . Standard accuracy 20 m Optional 15 m accuracy (at highest speed)

2 Fastest Time to Yield Highest uptime Flexible platform for all epoxy packagesProcess Quality for Highest YieldFuture Proof Equipment2nd GENERATION VISION SYSTEMCLEAN MACHINESTRIP THICKNESSCOMPENSATIONHIGH PRECISION BONDINGDOUBLEYhS 2100 xPplusThe Fastest 12 Epoxy Die BonderThe revolutionary Phi-Y pick-and-place produces a quantumleap in speed, with an increasing standard accuracy of 20 , the accuracy can even be improved, down to 15 distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation providethe shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder esec 2100 xpplus .

3 Standard accuracy 20 m Optional 15 m accuracy (at highest speed) Fastest Time to Yield Highest uptime Flexible platform for all epoxy packagesProcess Quality for Highest YieldFuture Proof EquipmentQFFNPSiPOtherOMEMSA utomotiveConsumerEElleectronicsMobileSub strateLeadframeEpoxyxDieAtAtachFilm2ndGE NERATIONVISION SYSTEMCLEANMACHINESTRIP THICKNESSCOMPENSATIONHIGH PRECISIONBONDINGDOUBLEYhS YhS Pattern Good quality at double process speed Better tailing characteristics Best suitable for medium sized rectangular diceClean Machine ISO class 5 (class 100)

4 Inside machine Reduces airborne particle through laminar flow Specially designed for CIS2nd Generation Vision System Good image quality with improved signal to noise ratio Reduced image transfer time Better recognition with new image sensorHigh Precision Bonding Improved placement accuracy by optimizing dynamics, Pick & Place Z-axis guides and bearings Standard pickup tools for high precision mode Position auto correction at dispense and bond Optionally availableStrip Thickness Compensation Strip thickness based Z-height correction Excellent bond line thickness control No UPH impact and easy setup Optionally availableMachine Dimensions Footprint: WxDxH: 1785 x 1448 x 1400 mm Weight: approx.

5 1400 kgSupply Requirements Voltage: 208 - 230 VAC (@ 47 - 63 Hz) Power rating: 800 - VA Compressed air: min. bar Vacuum: min. bar Nitrogen blow: - 6 barWafer and Die Dimensions Wafer size: 4 - 12 Frame size: 8 - 12 Die size: - 20 mm Die thickness: > mmLeadframe Size Width: 9 - 84 mm (100 mm opt.) Length: 90 - 300 mm Thickness: - mm Process Bond force: - 50 N Bond rotation 360 Heating at bond for WBC & Simple WBLA ccuracy / Productivity >2 mm: 20 m / (3 ) >2 mm: 15 m / (3 ) (option) - 2 mm: 20 m / (3 ) MTBF.

6 > 200hDouble YhS Pattern Good quality at double process speed Better tailing characteristics Best suitable for medium sized rectangular diceClean Machine ISO class 5 (class 100) inside machine Reduces airborne particle through laminar flow Specially designed for CIS2ndGeneration Vision System Good image quality with improved signal to noise ratio Reduced image transfer time Better recognition with new image sensorHigh Precision Bonding Improved placement accuracy by optimizing dynamics, Pick & Place Z-axis guides and bearings Standard pickup tools for high precision mode Position auto correction at dispense and bond Optionally availableStrip Thickness Compensation Strip thickness based Z-height correction Excellent bond line thickness control No UPH impact and easy setup Optionally availableMachine Dimensions Footprint: WxDxH: 1785 x 1448 x 1400 mm Weight: approx.

7 1400 kgSupply Requirements Voltage: 208 - 230 VAC (@ 47 - 63 Hz) Power rating: 800 - VA Compressed air: min. bar Vacuum: min. bar Nitrogen blow: - 6 barWafer and Die Dimensions Wafer size: 4 - 12 Frame size: 8 - 12 Die size: - 20 mm Die thickness: > mmLeadframe Size Width: 9 - 84 mm (100 mm opt.) Length: 90 - 300 mm Thickness: - mmProcess Bond force: - 50 N Bond rotation 360 Heating at bond for WBC & Simple WBLA ccuracy / Productivity >2 mm: 20 m / (3 ) >2 mm: 15 m / (3 ) (option) - 2 mm: 20 m / (3 ) MTBF: >.