Transcription of European Microelectronics and Packaging Symposium
{{id}} {{{paragraph}}}
Example: biology
European Microelectronics and Packaging Symposium
European Microelectronics and Packaging SymposiumPrague 16th to 18th June 2004, Czech RepublicTHERMAL conductivity OF MOLTEN LEAD FREE SOLDERSJAROMIR BILEK, JOHN ATKINSON, WILLIAM WAKEHAMU niversity of Southampton, School of Engineering Sciences, Thick Film Unit,Highfield, SO17 1BJ, Southampton, United KingdomE-mail: increasing influence of computational modelling in all technologicalprocesses generates an increased demand for accurate values of the physicalproperties of the materials involved, which are used as fundamental inputsfor every the production of electronic circuits, a thorough knowledge of thethermal conductivity of molten solders can result in a better controlledsoldering process.
European Microelectronics and Packaging Symposium Prague 16th to 18th June 2004, Czech Republic THERMAL CONDUCTIVITY OF MOLTEN LEAD FREE SOLDERS
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: