Transcription of European Microelectronics and Packaging Symposium
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European Microelectronics and Packaging Symposium
European Microelectronics and Packaging SymposiumPrague 16th to 18th June 2004, Czech RepublicTHERMAL conductivity OF MOLTEN LEAD FREE SOLDERSJAROMIR BILEK, JOHN ATKINSON, WILLIAM WAKEHAMU niversity of Southampton, School of Engineering Sciences, Thick Film Unit,Highfield, SO17 1BJ, Southampton, United KingdomE-mail: increasing influence of computational modelling in all technologicalprocesses generates an increased demand for accurate values of the physicalproperties of the materials involved, which are used as fundamental inputsfor every the production of electronic circuits, a thorough knowledge of thethermal conductivity of molten solders can result in a better controlledsoldering process. As a result, this information can be used for setting theoptimum soldering profile and thereby lead to improvement in the qualitycontrol of the solder paper describes the principles of the experimental technique employedfor the measurement of the thermal conductivity of molten solders anddescribes the essential features of the instrumentation.
cannot be used directly for the evaluation of the thermal conductivity of the molten metals, although the basic dependence on the property remains intact.
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