AEC - Q100-005 - REV-D1 January 9, 2012 …

AEC - Q100-005 - REV-D1 January 9, 2012 Component Technical Committee Automotive Electronics Council ATTACHMENT 5 AEC - Q100-005 - REV-D1 NON-VOLATILE MEMORY PROGRAM/ERASE ENDURANCE,

  Memory, Volatile, Volatile memory

STRESS TEST QUALIFICATION FOR PASSIVE COMPONENTS

AEC-Q200 REV D June 1, 2010 Component Technical Committee Automotive Electronics Council Page 2 of 74 Acknowledgement Any Document involving a complex technology brings together experience and skills from many sources.

STRESS TEST QUALIFICATION FOR AUTOMOTIVE GRADE …

4. J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 5. JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing 1.2.3 AEC 1. AEC - Q001 Guidelines for Part Average Testing 2. AEC - Q101 - 001 ESD (Human Body Model) 3.

  States, Tests, Qualification, Grade, Stress, Automotive, Solid, Nonhermetic, Stress test qualification for automotive grade, For nonhermetic solid state

AEC - Q006 - REV - A QUALIFICATION REQUIREMENTS FOR ...

copper (Cu) wire interconnections for components to be used in any automotive electronics application. While the set of tests highlighted here are replicated in AEC-Q100/Q101, this document details any different test conditions and/or durations plus the activity around these tests that are unique requirements for ensuring Cu wire reliability. ...

  Interconnection

FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …

test driven qualification requirements and references test conditions for qualificati on of integrated circuits (ICs). These tests are capable of stimulating and precipitating semiconductor device and package failures. The objective is to precipitate failures in an accelerated manner compared to use conditions.

  Tests, Qualification, Test qualification, Qualificati, Qualificati on

GUIDELINE FOR CHARACTERIZATION OF INTEGRATED …

Xin Miao Zhao [Q003 Team Leader] Cirrus Logic Ramon Aziz Delphi Corporation Paul Grosch Freescale Nick Lycoudes Freescale Laurie McTurk Freescale James Stanley Freescale Drew Hoffman Gentex Richard Lauks Infineon Harold Lorenz Infineon Jochen Roeder Infineon Tim Weyland Infineon Banjie Bautista ISSI Gary Fisher Johnson Controls

  Guidelines, Integrated, Characterization, Logic, Cirrus, Guideline for characterization of integrated, Cirrus logic

Automotive Electronics Council

using a thermal compression or thermosonic wire bonding process. The ball bond includes the enlarged spherical portion of the wire (sometimes referred to as the nail head and formed by the flame-off and first bonding operation in thermal compression and thermosonic process), the underlying bonding surface, and the intermetallic weld interface.

  Electronic, Council, Automotive, Bonding, Automotive electronics council, Thermosonic