Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q100 - Rev-G. May 14, 2007. FAILURE MECHANISM BASED . STRESS TEST QUALIFICATION . FOR. INTEGRATED CIRCUITS. Automotive Electronics Council Component Technical Committee AEC - Q100 - REV-G. May 14, 2007. Automotive Electronics Council Component Technical Committee TABLE OF CONTENTS. AEC-Q100 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Integrated Circuits Appendix 1: Definition of a QUALIFICATION Family Appendix 2: Q100 Certification of Design, Construction and QUALIFICATION Appendix 3: Plastic Package Opening for Wire Bond Testing Appendix 4: Minimum Requirements for QUALIFICATION Plans and Results Appendix 5: Part Design Criteria to Determine Need for EMC Testing Appendix 6: Part Design Criteria to Determine Need for SER Testing Attachments AEC-Q100-001: WIRE BOND SHEAR TEST. AEC-Q100-002: HUMAN BODY MODEL (HBM) ELECTROSTATIC DISCHARGE (ESD) TEST. AEC-Q100-003: MACHINE MODEL (MM) ELECTROSTATIC DISCHARGE (ESD) TEST.
test driven qualification requirements and references test conditions for qualificati on of integrated circuits (ICs). These tests are capable of stimulating and precipitating semiconductor device and package failures. The objective is to precipitate failures in an accelerated manner compared to use conditions.
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