Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q101 - Rev - E March 1, 2021 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q101 - Rev - E March 1, 2021 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q101 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Discrete Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: Q101 Certification of Design, Construction and QUALIFICATION Appendix 3: QUALIFICATION Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements Appendix 6: Plastic Package Opening for Wire Bond Testing and Inspection Appendix 7: AEC-Q101
for AEC-Q101 qualification and there is no certification board run by AEC to qualify parts. The minimum ambient temperature range for discrete semiconductors per this specification shall be - 40°C to +125°C operational. Any parts being qualified with Cu wire must follow the requirements in AEC-Q006. The test
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