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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q102 - Rev A April 6, 2020 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR OPTOELECTRONIC SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q102 - Rev A April 6, 2020 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q102 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Optoelectronic Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: AEC-Q102 Certification of Design, Construction and QUALIFICATION Appendix 3: AEC-Q102 QUALIFICATION Test Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements and FAILURE Criteria Appendix 6: Destructive Physical Analysis (DPA) Appendix 7: AEC-Q102 and the Use of Mission Profiles Appendix 7a: Reliability Validat
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires. JESD51-50 Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip Single- and Multi-PN Junction Light-Emitting Diodes (LEDs) JESD51-51 Implementation of the Electrical Test Method for the Measurement of Real Thermal
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