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MIL-STD-883E, Test Method Standard for Microcircuits

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METHOD NO. MECHANICAL TESTS 2021.3Glassivation layer integrity 2022.2Wetting balance solderability 2023.5Nondestructive bond pull 2024.2Lid torque for glass-frit-sealed packages 2025.4Adhesion of lead finish 2026 Random vibration 2027.2Substrate attach strength 2028.4Pin grid package destructive lead pull test 2029 Ceramic chip carrier bond ...

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