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MIL-STD-883E, Test Method Standard for Microcircuits

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0,/ 67' ( '(&(0%(5 '(&(0%(5 683(56(',1* 683(56(',1*0,/ 67' '0,/ 67' ' 129(0%(5 129(0%(5 '(3$570(17 2) '()(16('(3$570(17 2) '()(16(7(67 0(7+2' 67$1'$5'7(67 0(7+2' 67$1'$5'0,&52&,5&8,760,&52&,5&8,76$06& 1 $ )6& ',675,%87,21 67$7(0(17 $',675,%87,21 67$7(0(17 $ $SSURYHG IRU SXEOLF UHOHDVH GLVWULEXWLRQ LV XQOLPLWHG $SSURYHG IRU SXEOLF UHOHDVH GLVWULEXWLRQ LV XQOLPLWHG 7KH GRFXPHQWDWLRQ DQG SURFHVVFRQYHUVLRQ PHDVXUHV QHFHVVDU\ WRFRPSO\ ZLWK WKLV UHYLVLRQ VKDOO EHFRPSOHWHG E\ 0D\ ,1&+ 3281',1&+ 3281'MIL-STD-883EiiFOREWORD1. This military Standard is approved for use by all Departments and Agencies of the Department of Defense.))))))))))))))))))))))))))))

METHOD NO. MECHANICAL TESTS 2021.3Glassivation layer integrity 2022.2Wetting balance solderability 2023.5Nondestructive bond pull 2024.2Lid torque for glass-frit-sealed packages 2025.4Adhesion of lead finish 2026 Random vibration 2027.2Substrate attach strength 2028.4Pin grid package destructive lead pull test 2029 Ceramic chip carrier bond ...

  Tests, Solderability

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