Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q101 - Rev - E March 1, 2021 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q101 - Rev - E March 1, 2021 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q101 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Discrete Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: Q101 Certification of Design, Construction and QUALIFICATION Appendix 3: QUALIFICATION Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements Appendix 6: Plastic Package Opening for Wire Bond Testing and Inspection Appendix 7: AEC-Q101 and the Use of Mission Profiles Attachments AEC-Q101-001: Electrostatic Discharge Test - Human Body Model AEC-Q101-002: Electrostatic Discharge Test - Machine Model (DECOMMISSIONED) AEC-Q101-003: Wire Bond Shear Test AEC-Q101-004: Miscellaneous Test Methods AEC-Q101-005: Electrostatic Discharge Test Charged Device Model AEC-Q101-006: Short Circuit Reliability Characterization of Smart Pow
John Timms Continental Corporation Pam Finer Diodes Incorporated Frank Chen Diodes Incorporated Drew Hoffman Gentex Corporation Steve Sibrel Harman Uwe Berger Hella ... Arthur Chiang Vishay HJ Lin Vishay Larry Dudley ZF This document is dedicated in memoriam to: Bob Knoell (1957-2018) AEC - Q101 - Rev - E
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