Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q102 - Rev A April 6, 2020 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR OPTOELECTRONIC SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q102 - Rev A April 6, 2020 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q102 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Optoelectronic Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: AEC-Q102 Certification of Design, Construction and QUALIFICATION Appendix 3: AEC-Q102 QUALIFICATION Test Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements and FAILURE Criteria Appendix 6: Destructive Physical analysis (DPA) Appendix 7: AEC-Q102 and the Use of Mission Profiles Appendix 7a: Reliability Validation for Optoelectronic Semiconductors Attachments AEC-Q102-001: DEW TEST (DEW) AEC-Q102-002: BOARD FLEX TEST (BF) AEC-Q102-003: OPTOELECTRONIC MULTICHIP MODU
AEC-Q102 Failure Mechanism Based Stress Test Qualification for Optoelectronic ... Destructive Physical Analysis (DPA) Appendix 7: AEC-Q102 and the Use of Mission Profiles ... JEDEC JESD-22 Reliability Test Methods for Packaged Devices J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires. ...
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