Transcription of Final Product/Process Change Notification
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Final Product/Process Change Notification
T EM001793 Rev. O Page 1 of 3 Final Product/Process Change Notification Document # : FPCN20930XB Issue Date: 7 March 2018 Title of Change : Qualification of Power Schottky Die-Shrink for DPAK, SO8 FL and TO-220 Package. Proposed first ship date: 14 June 2018 Contact information: Contact your local ON Semiconductor Sales Office or < Samples: Contact your local ON Semiconductor Sales Office Additional Reliability Data: Contact your local ON Semiconductor Sales Office or Type of Notification : This is a Final Product/Process Change Notification (FPCN) sent to customers.
Type of notification: This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 daysprior to implementation of the change. ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact <PCN.Support@onsemi.com>.
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