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FIREFLY - Samtec

FI R EFLY APPLICATION DESIGN GUIDEFIREFLY Flexibility of copper and optical using the same micro connector allows for increased density , simplified PCB and reduced power connection is taken off board for up to 28 Gbps per lane with a path to 112 Gbps PAM4 via optical cable at greater distances or copper for cost assembly process with easy insertion/removal and trace routing, no through-holes, and a 2-piece surface mount connector FLYOVER SYSTEM Variety of rugged options ideal for harsh environmental MICRO FOOTPRINTHIGH PERFORMANCE VERSATILITYEASE OF USE2 Learn more at MICRO FLYOVER SYSTEM COMMERCIAL FIREFLY .

On-package interconnect enables 56 Gbps PAM4 performance, eliminates distortion through the BGA region and improves density. MT Low insertion force connectors for high-density cabling and backplane applications MPO (MTP®) High-density connectors for panel applications and minimal keep-out areas on the board MXC® High-density connectors

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  High, Density, Interconnect, Firefly

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