Transcription of Flex-Rigid Design Guide - WE Home
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Flex-Rigid Design GuideDESIGN GUIDEV ersion / March trend to miniaturization in electronics continues. Integrated circuit board solutions are becoming more and more popular as a means of effi-ciently utilizing the even smaller casing volume in all three dimensions. Flexible foils of polyimide with a typical thickness of 50 m are materials that withstand high temperatures and can be used with copper-cladding as base material for pure flex circuit boards or in combination with rigid base materials for Flex-Rigid circuit boards with all the prevalent solde-ring methods.
4. Materials and design parameters 5. Mechanical design 6. Layout and routing 7. Documents for manufacturing flex rigid circuit boards Basically, standards must be regarded such as IPC-2223, IPC-6013, the Basic Design Guide from Würth Elektronik, as well as variant-specific design rules and our drying recommendations. Heterogeneous system
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