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From Sand to Silicon

Copyright 2011, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries. 1 From Sand to Silicon Making of a Chip Illustrations32nm High-K/Metal Gate VersionIncluding 2nd Generation Intel Core processor familyApril 2011 Copyright 2011, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries. 2 The illustrations on the following foils are low resolution images that visually support the explanations of the individual publishing purposes there are high resolution JPEG files posted to the Intel high resolution images are available as well. Please request them from 2011, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries.

Ion Implantation Applying Photo Resist – scale: wafer level (~300mm / 12 inch) Fabrication of chips on a wafer consists of hundreds of precisely controlled steps which result in a series of patterned layers of various materials one on top of another. What follows is a sample of the most important steps in this complex process. In

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