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High-performance Printed Circuit Board Production Equipment for Ultra- high Density multi -layer Wiring 216 High-performance Printed Circuit Board Production Equipment for Ultra- high Density multi -layer WiringNorio MichigamiMasatoshi YamagaMasahiro KawamuraOsamu KuzeShigeo NakamuraINTRODUCTIONTHE trend toward producing PCBs ( Printed Circuit boards) with higher densities as electronic products have become more sophisticated is driving demand for smaller diameters and higher precision in the machining of interlayer connection holes on PCBs by mechanical and laser drilling the Circuit patterns produced by the OVERVIEW: Recent years have seen dramatic progress in the performance of electronic devices such as mobile phones, notebook PCs, and electronic
High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring 218 spindle speeds as well as smaller diameters, with
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