Transcription of High-Speed Layout Guidelines for ... - Texas Instruments
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High-Speed Layout Guidelines for ... - Texas Instruments
1 SLLA414 August2018 SubmitDocumentationFeedbackCopyright 2018,TexasInstrumentsIncorporatedHigh-Sp eedLayoutGuidelinesfor SignalConditionersand USBHubsApplicationReportSLLA414 August2018 High-SpeedLayoutGuidelinesfor SignalConditionersand moderninterfacefrequenciesscalehigher,ca remustbe takenin the printedcircuitboard(PCB)layoutphaseof a designto ensurea highspeedlayoutsguidelinesrelatingto USB,USBHubs,HDMI,DisplayPort,PCIeand of Figures1 Intervs. IntraPair CapacitorAcrossa AC Via Via SpacingNextto SpacingNextto Clockor a of August2018 SubmitDocumentationFeedbackCopyright 2018,TexasInstrumentsIncorporatedHigh-Sp eedLayoutGuidelinesfor SignalConditionersand USBHubs2 PossibleBoardStack-upon a a trademarksare the propertyof August2018 SubmitDocumentationFeedbackCopyright 2018,TexasInstrumentsIncorporatedHigh-Sp eedLayoutGuidelinesfor SignalConditionersand applicationreportcan help systemdesignersimplementbest practicesand understandPCBlayoutoptionswhenusingdi
These differences include parameters like data-rates/frequency, AC coupling capacitors, inter-pair skew, intra-pair skew and trace impedance. Below are standard values for the different high standards. The following values and suppose to be guidelines are not always exact ... Texas Instruments, Incorporated [SLLA414,*] Subject: Application Notes
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