IC1000™ Polishing Pad - 上海翊华光电科技有限公司

2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole orpart, without the express permission of Rohm and Haas Electronic , Rev. 0, 9/05 DESCRIPTIONIC1000 pad is the industry-standard Polishing padfor chemical mechanical planarization (CMP). TheIC1000 pad is made of a rigid, micro-porouspolyurethane material. These properties enable theIC1000 pad to deliver localized planarization,excellent removal rates, low global non-uniformityand low defectivity. The IC1000 pad works effectivelywith slurries and conditioners to optimize CMPperformance in Tungsten, Copper, ILD, STI, andpolysilicon CONFIGURATIONT hicknessThe standard thickness for an IC1000 pad is 50 mils,but it is also offered in a thickness of 80 mils if astiffer pad is Endpoint WindowIC1000 pads are offered with a transparent urethanewindow to enable the optical endpoint technology inleading edge CMP tools.

© 2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole or part, without the express permission of Rohm and Haas Electronic Materials.

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