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IC1000™ Polishing Pad - 上海翊华光电科技有限公司

2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole orpart, without the express permission of Rohm and Haas Electronic , Rev. 0, 9/05 DESCRIPTIONIC1000 pad is the industry-standard Polishing padfor chemical mechanical planarization (CMP). TheIC1000 pad is made of a rigid, micro-porouspolyurethane material. These properties enable theIC1000 pad to deliver localized planarization,excellent removal rates, low global non-uniformityand low defectivity. The IC1000 pad works effectivelywith slurries and conditioners to optimize CMPperformance in Tungsten, Copper, ILD, STI, andpolysilicon CONFIGURATIONT hicknessThe standard thickness for an IC1000 pad is 50 mils,but it is also offered in a thickness of 80 mils if astiffer pad is Endpoint WindowIC1000 pads are offered with a transparent urethanewindow to enable the optical endpoint technology inleading edge CMP tools.

© 2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole or part, without the express permission of Rohm and Haas Electronic Materials.

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Transcription of IC1000™ Polishing Pad - 上海翊华光电科技有限公司

1 2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole orpart, without the express permission of Rohm and Haas Electronic , Rev. 0, 9/05 DESCRIPTIONIC1000 pad is the industry-standard Polishing padfor chemical mechanical planarization (CMP). TheIC1000 pad is made of a rigid, micro-porouspolyurethane material. These properties enable theIC1000 pad to deliver localized planarization,excellent removal rates, low global non-uniformityand low defectivity. The IC1000 pad works effectivelywith slurries and conditioners to optimize CMPperformance in Tungsten, Copper, ILD, STI, andpolysilicon CONFIGURATIONT hicknessThe standard thickness for an IC1000 pad is 50 mils,but it is also offered in a thickness of 80 mils if astiffer pad is Endpoint WindowIC1000 pads are offered with a transparent urethanewindow to enable the optical endpoint technology inleading edge CMP tools.

2 Advanced optical endpointpads feature a window that is bonded to the IC1000pad to prevent slurry leakage and window delamina-tion in all CMP pad is offered in a wide variety of diametersand shapes making it compatible with leading edgeCMP tools. These pads are designed to work withleading rotary, orbital and belt CMP tools making theIC1000 pad the industry standard CMP contact your local Rohm and Haas ElectronicMaterials technical sales representative to determinethe IC1000 pad configuration that would yield thebest results and lowest cost of ownership in yourCMP pad is offered in a wide variety of groovingpatterns across the surface of the pad. Pleaseconsult your local representative for the pattern thatwill meet the needs of your CMP compressible subpad improves the global non-uniformity performance of IC1000 pad. These padsare offered with a variety of subpads depending onthe performance needs of the process.

3 Suba IV subpad is the industry standard subpad. SP2000 subpads are the next generation of subpads, which offer improvements in reliability Polishing PadPolishing PadIntegrated Window bonds windowmaterial to IC1000 Subpads Show Improved Planarization VersusSuba


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