“Photoneece ”” DL-1000 - toray.jp

1 1 PositivePositive--Tone Photosensitive PolyimideTone Photosensitive Polyimidefor Insulation Layer in OLED/PLEDfor Insulation Layer in OLED/PLED PhotoneecePhotoneeceTMTM DLDL--10001000 Toray Industries, between DL-1000 and Novolak-resist / Acryl-resist< >2 Spacer Structures in OLED* Spacer means a generic name of insulating layer, bank layer and LayerInsulation LayerInsulation Layer shape requirements Round edge shape Low tapered angle (20-40 ) Thickness 1umAnodeRib layer (Negative photoresist)CathodeEmitting layerAnodePlanarization layerTFTG lassGlassEmitting layerCathode<Passive matrix> <Active matrix>3DL-1000 vs. Other MaterialsDL-1000 is the best material for an insulation layer in OLED/PLED012345 Patterning performanceElectrical performanceThermal stability(Outgas)Adhesion to substratesPixel shrinkageLow tapered angleSolution stabilityDL-1000 AcrylNovolak PR4 Material solution for Pixel Shrinkage Initial72hr80 C/DryToray s polyimideAcrylic resinNovolak resinPixel shrinkage0%47%64% with alkaline solution ( TMAH) resolution: 1um line/space @1 m temperature cure (230 C/30min in air) side wall electrical and chemical thermal stability (Lower outgas) adhesion to various UV-O3& O2-plasma solution stability10.

2 Compatible with existing display process with alkaline solution ( TMAH) resolution: 1um line/space @1 m temperature cure (230 C/30min in air) side wall electrical and chemical thermal stability (Lower outgas) adhesion to various UV-O3& O2-plasma solution with existing display process toolsFeatures of DL-10006 Family of PhotoneeceTM DL-1000 OLED(Low molecular EL)PLED(Polymer EL) DL-1000 FeaturesTarget thickness1-2 m1-2 m1-2 m2-4 mTapered angle35-45 degree35-45 degree20-30 degree45-60 degreeStandard grade30, 44 mPa s40 mPa s40 mPa sTarget coaterSpinSlit SpinSpinSpinSpinPhotosensitivityExcellen tGoodExcellentGoodGoodSL-1900SL-3000SL-1 100-4 Wide developing process marginLow tapered angleHigh Tapered AngleViscosityProcess margin(developing) 40-50 mPa sExcellentGoodGood7 OLED PLEDDL-1000SL-1900SL-3000SL-1100-4 FeaturesStandard gradeWide developmarginLow TapaeredAngleHigh TaperedAngleThickness1 2 m1-2 m1-2 m2-4 mViscosity30, 44 mPa s40 mPa s40 mPa s50, 160 mPa sCoaterSpin, Slit&SpinSpinSpinSpin, Slit&SpinPrebakingHotplate120 C 2min120 C 3minExposureBroad Band (at I-line)70mJ/cm260mJ/cm250mJ/cm2150mJ/cm2 ReagentTMAH C 30min (in air)230 C 30min(in air)Hotplate160 C 15min 230 C 15min160 C 15min 230 C 15minResidual thickness ratioat unexposured part77%90%88%94%PropertiesTapered Angle 35-45 35-45 20-30 45-60 CuringDevelopmentConditionApplicationDet ails of DL-1000 Family810um L&S (x20k)Cross Sectional ViewsFor OLEDFor PLED10um L&S (x3k)10um L&S (x20k)10um L&S (x20k) Thickness: 1um Round shape Low tapered angle(20-40 ) Thickness.

3 2um High tapered angle(45-60 ) 25 35 50 9 Dielectric Breakdown Strength (Thermal Stability) Holding at 85 C05010015020025030035040005101520 Days (at 85 C)Dielectric Strength (kV/mm) DL-1000 AcrylNovolakCure: 230 Cfor 30min (in air)Holding: 85 C(in air)Measurement: JIS C 211010 Dielectric Breakdown Strength (Light Stability)Cure: 230 Cfor 30 min (in air) Irradiation: Xe Longlife Fademeter (Suga)irradiance(300-400nm) 37W/m2, illuminance(400-700nm) 7,300lxMeasurement: JIS C 21100501001502002503003504000510 15 20 Irradiation Time (day)Dielectric Strength (kV/mm) DL-1000 AcrylNovolak Under irradiation11 Thermal Stability (Outgas): TGA Analysis50607080901001100 100 200 300 400 500 Temperature ( C)Normalized weight (%) DL-1000 AcrylNovolakCure: 230 Cfor 30min (in air)Measurement: TGA analysis ( >400 C, in N2) Heating from to 400 Cafter 230 Ccure12 Holding at 120 Cafter 230 CcureCure: 230 Cfor 30min (in air)Annealing: at curing temp(230 C) for 10min in the TG-MS apparatusMeasurement: at 120 Cfor 4 hrOutgas Components of DL-1000 : TG-MS02468100 50 100 150 200 250 300 Time (min)Amount of gas evolution (wtppm)m/z 18m/z 42m/z 44m/z 54m/z 94m/z 99total gasat 120 CNo OutgasNo Outgas1305001000150020002500300005010015 0200 Temperature (C)Volatile H2O weight (ppm) DL-1000 AcrylNovolakWater Absorption in the AtmosphereCuring condition: 230C for 30min (in air)Storage: 24 hr in the atmosphere (25C, 60%RH)Measurement: monitoring the weight loss by TGA analysis14 Film Properties of DL-1000 Cure: 230 Cfor 30min (in air)Tensile Strength120 MPaElongation10 %Young s Modulus3 GPaCoefficient of Thermal Expansion36 ppm/KGlass Transition Temperature (Tg)200oCDielectric Constant (25 C) /kHzVolume.

4 CmElectrical PropertiesThermal Properties5% Weight Loss Temperature350oCSurface Dielectric Breakdown Strength350 kV/mmMechanical Properties15 Chemical ResistanceDipping Time (at )Organic (Ethyl lactate) ( -Butyrolactone) solventNMP (N-methyl-2-pyrrolidone) , (4wt%; pH= ) acidH2SO4(1wt%; pH= ) acidCH3 COOH (67wt%; pH= ) min5 min10 minCured Film Thickness ( m)**Cure condition: 230C for 30min in airThe thickness shows no change against the various to various substratesDL-1000 AcrylNovolak-PRITO>500hr50hr100hrGlass(c orning 1737)>500hr100hr50hrSiO2>500hr200hr50hr* Until the above adhesive time, the crosscut film is retained on the substrates without peeling. **The longer the adhesive retention time is, the higher the adhesion to the substrates is. Cure condition: 230 Cfor 30min (in air)PCT (Pressure Cooker Test) condition: 121 C, ( ), 100%RHMeasurement : Crosscut the cured film in 1mmx1mmx100pieces on the substratesScotch tape peel test (JIS K 5600) Tape-pull adhesion test with PCT treatment<Adhesive retention time>Cured film sampleScotch tape Substrate17UV-O3 Treatment Time (min)Thickness Reduction (um) DL-1000 AcrylNovolakCure condition: 230 Cfor 30min (in air)UV-O3 treatment: O3 concentration 100+-50ppmGap to lamp 25mmIlluminance15mW/cm2 (at 254nm)18O2-plasma Treatment 5 10 15 20O2-Plasma Time (min)Thickness Reduction (um) DL-1000 AcrylNovolakCure condition: 230 Cfor 30min (in air)O2-plasma Treatment: Power 300W Degree of vacuum < Process Condition for DL-1000 An example for patterning processThickness Measurement Apparatus: DNS Lambda STM-6021.

5 Solution viscosity 44 mPa s (25 C)2. Substrate ITO; 3. Spin coating500rpm/10sec + 1200rpm/30sec4. Edge back rinseOK73thinner (PGME/PGMEA) 5. Prebaking120 C/120sec (Hot plate) [Thickness um]*Measure surface temp. at the top of a glass substrate6. Exposure 70mJ/cm2 (Broad band, ghi mixed line)or 200mJ/cm2 (I-line stepper)7. Development (Dipping)30sec ( TMAH) and 30sec (H2O Rinse) [Thickness um]8. Curing 1) Oven: 230 C/30min (in air) 2) Hot Plate: 160 C/15min + 230 C/15min [Thickness um]2012349650mm550mmCoating Thickness Uniformity of DL-1000 (30mPa s)<Coating Condition>Viscosity: 30cPSPIN: 1300rpm for 8sec, slit&spin ( )Vacuum dry: Slow vacuum for 5sec Main vacuum 40 MPa ( ) for 63secEdge Rinse: OK73thinner (PGMEA/PGME)<Coating Thickness Uniformity>MAX umMIN umMEAN value um ( )<Coating Thickness Uniformity>MAX umMIN umMEAN value um ( ) Using a DNS s Coating System21 Solution Viscosity in the Shelf Life010203040500102030 Storage days (at 23 C)Viscosity (mPa s)No Change Holding at 23 CNo Change220123450 20406080 Storage days (at 23 C)Defect Density (particles/cm2)Measurement apparatus: Hitachi LD-5000 (particle size > ) Holding at 23 CNo particleParticles in the Shelf LifeNo particl