Positive Tone Photosensitive Polyimide …

1 TORAY Industries, Tone Photosensitive PolyimidePositive Tone Photosensitive Polyimide PhotoneecePhotoneece PWPW--1500 series1500 seriesIntroduction of PW series+Photosensitivity+High Tg+Chemical ResistanceNon- Photosensitive PolyimidePW-1000 seriesPW-1000 seriesPW-1500 seriesPW-1500 seriesPositive Photosensitive PolyimideCoating PW seriesPositive Photosensitive PolyimideCoating PW seriesPW1500 seriesis the improved gradefor multi-layer and bump process buffer coat use+Photolithography +Alkaline DevelopabilityPW-1500 series are Positive tone Photosensitive Polyimide coatings with high glass transition temperature, Super high chemical resistance, and the following of PW-1500 series(1 Good Film Performance(2) Wide Cure Process Window 3 Good Photolithographic Performance 4 Good Solution StabilityPW-series basic propertiesPW-1000PW-1200PW-1500viscosity 1,5001,500 3,0001,500total solid content3840 4440-16 Cmonth9994 Cmonth666room temp.)

2 Month111thickness3-73-103-7tensile strength130150150250 C cure%-2020320 C cure%302020350 C cure%202010380 C cure%102010400 C cure%102010young's C cure MPa-2635320 C cure MPa2836385% weight loss C cure C-230250320 C cure C270305320350 C cure C270305380380 C cure C270305400400 C cure C270305430dielectric resistance>10^16>10^16>10^16surface resistance>10^16>10^16>10-16breakdown voltage>420>420>420water (320 C)ppm/ C C(320 C) (320 C)umkV/mm- cm cm2%Tg(TMA)liquid propertyresidual stresslife timeelogationfilm propertyPW-series basic propertiesPW-1000PW-1200PW-1500coatspins pinspinprebake120/3120/3120/33ummJ/cm217 51501505ummJ/cm24003003007ummJ/cm2650550 550 PEBNot requiredNot requiredNot requireddevelop20-12020-12020-120cure320 -380250-380250-380 NMPrt/15minGBLrt/15minno changeELrt/15minno changeacetone rt/15mincrackPGMEA rt/15minno changeresist stripperDMSO/mono-ethanolamine90 C/30min50% thickness decrease 10% thickness decrease 10% thickness decrease25%NaOH 40 C/10minno change10%KOH 40 C/10minno changeH2SO4/H2O2 40 C/10minno change1%HF /5minno changefluxDeltalux533 290 C/30seccrackcleanerPine-arfa 40 C/30minno changewithout HMDS C/minprocess performancechemical resistancesec C/minexposuresolventalkakineetchantno changeno changeno changeno changeno changeno changeno changeno changeno changeno changeno

3 Changeno changeno changeno changeno changeno changeno changeno changeno changeno changeno changeno changeno changeComparison of Film Performance of PW-1000 with PW-1500 Tensile Strength Elongation Young s Modulus 140 MPa 15% PropertiesThermalProperties 5% Weight Loss Temperature 1% Weight Loss Temperature Tg (TMA) 356oC 309oC 250oCPW-1500250 C 1320 C 1 148 MPa 20% 465oC 391oC 320oCPW-1000250 C 1320 C 1 Curing ConditionPSPI nameImpossibleto measure 328oC 302oC Impossibleto measure 130 MPa 30% 458oC 395oC 270oCFilm Performance of PW-1500 Tensile Strength Elongation Young s Modulus 140 MPa 20% PropertiesThermalProperties 5% Weight Loss Temperature 1% Weight Loss Temperature Tg (TMA) 356oC 309oC 250oCPW-1500 148 MPa 24% 465oC 391oC 320oCCuring ConditionPSPI name 495oC 410oC 380oC 65 MPa 12% 523oC 447oC 430oC 131 MPa 11% C 1h320 C 1h350 C 1h400 C strippercure condition400 C 30min N2)PIinitial KOH Swelling) 0(Dissolved) conditionthickness( m)96 C 40minSolvent resistancesolventPW-1000 PW-1500ethyl lactate30s butyl acetate30s PGMEA120s 25%NaOH H2SO4/H2O2/H20=1/2/24 250 C 60min N2)cure conditionChemical Resistance of PW-1500(1)Chemical Resistance of PW-1500(2) Polyimide cure condition.

4 140 C 60min+350 C 60min ChemicalsConditionResulltN-methylpyrroli doneRT 15minNo changeSolventgamma-butylolactoneRT 15minNo changeEthyl lactateRT 15minNo changeAcetoneRT 15minNo changePGMEART 15minNo changeResist stripper DMSO/monomethanolamine 80C 30min 10% thickness decresaseAlkali25%NaOH40C 10minNo change10% KOH40C 10minNo changeEtchantH2SO4/H2O240C 10minNo change1% HFRT 5minNo changeFluxSenjyu Deltalux 533290C 20secNo changeCleanerArakawa Pine-arfa40C 30minNo changeSolution Stability of PW-1500 Viscosity Stability05001000150020000102030 Storage days (23 C)Viscosity (mPa s)Eth0100200300400500600051015 Strage Days (23C)Eth(mJ/cm2)Cure Koyo-Thermo Systems CLH-21 CDPCT :121 C, 2 atmAdhesion of PW-1500 to Substrate (Si and SiN)0 50 100 0 50 100 0 50 100 10000 Oxygen 1100250 PCT treatment time CFinal Curing Temperature C C 0 50 100 C Spincoat 700rpm for 10sec and 2750rpm for 30secPrebaking120oC 3min (Hot plate) ( m)Exposure325 mJ/cm2 (g-line, i-line stepper)Development90 sec.

5 Paddle development ( m)( TMAH solution)Curing140oC for 30min+350oC for 60min (N2)( m)Patterning Process of PW-1500 for 5 m Thickness after 350 oC Oven CureRotation speed vs. Film thickness after PBy = 1000 1500 2000 2500 3000 3500 4000 Rotation Thickness Patterning process of PW-1500 by Mark-7 (TEL) PSPI coat (Mark 7)C/S Dehydro-Bake (DHP) 230 C X 60 s Coater RecipeCOL 23 C X 60 sSTEP Time Rotation Accel Dispence (sec) (rpm) (rpm/sec)COAT1 200 1000 0 2 0 1000 0 Pre-Bake (HP) 120 C X180 s3 700 2000 0 4 X 1000 0 COL 23 C X 60 s5 0 1000 0 Dispence PSPI at step 1C/SFilm thickness is controled in step Stepper GCA 8000 DSW WAFER STEPPER Exposure time 650 msec (325mJ/cm2)focus 0 mm Development (Mark 7)C/SDevelopment recipe STEP Time Rotation Accel DispenceDEV1 1000 10000 0 2 1000 10000 1 7C/S3 500 10000 1 74 100 10000 1 75 30 10000 1 76 10000 57 1000 10000 1 78 500 10000 1 7 Dispence 100 10000 1 71 development10 30 10000 1 73:rinse11 0 10000 54 back rinse12 10000 55: auto damper13 500 10000 3 4 97: dev.

6 N214 2000 10000 3 4 99: rinse N215 3000 10000 0 Developer: TMAH , Flow rate: L/minRinse water , Flow rate: L/minBack rinse water , Flow rate: 150 mL/minExhaust: 60 PaNozzle: Stream nozzle CuringHP Apparatus: Mark7(TEL)Condition:140 C 4min 250 C 4min 350 C 4min 70 C 1minOxygen concentration: Nitrogen gas purgeOven Apparatus: Koyo-Thermosystem Condition: 140 C 30 min 350 C 60 min (slope C/min)Oxygen concentration: less than 100ppm (Nitrogen gas purge) Exposure5 m L&S Pattern Profile of PW-1500 after 350 oC Cure10 m L&SExposure: i-line Stepper (GCA DSW-8000:NA= )Dose: 350 mJ/cm2 m after Curing on Si(5 m Thickness after Curing)