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Chemical Mechanical Planarization - bitsonchips
www.bitsonchips.comChemical Mechanical Planarization PT/01/003/JT 2 During the CMP of patterned copper wafers, two phenomena – copper dishing and SiO2 erosion – lead to deviations from the ideal case depicted in …
ALUMINA, CERIA AND ZIRCONIA SLURRIES FOR CMP …
www.isurface.comFM.4720.1.04.TAPS ALUMINA, CERIA AND ZIRCONIA SLURRIES FOR CMP PLANARIZATION TENSOR-AP Series Products are abrasive slurries made of tightly sized, high purity, sub-micron metal-
Cabot Microelectronics Corporation - CMP Consulting
cmpconsulting.org5 ITRS 2007 Planarization Consumables First Year of IC Production DRAM 1/2 Pitch 2007 65nm 2008 57nm 2009 50nm 2010 45nm 2011 40nm 2012 35nm 2013 32nm 2014 28nm