Transcription of IPC-7251 Generic Requirements for Through-Hole …
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IPC-7251 Generic Requirements for Through-Hole …
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard 1st Working Draft June 2008 1 SCOPE This document provides information on land pattern geometries used for the Through-Hole attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of through land patterns to insure sufficient area for the appropriate solder fillet around the lead to meet the Requirements of IPC/EIA J-STD-001 and the workmanship standard IPC-A-610, and also to allow for inspection, testing, and rework of those solder joints.
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard 1st Working Draft – June 2008 1 SCOPE This document provides information on land pattern geometries used for the through-hole attachment of electronic
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