Standard dual spindle dicing saw - DISCO Corporation

Maximized throughput The DFD63400 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to

  Dual, Spindle, Dual spindle

Automatic Dicing Saw DAD3350 - disco.co.jp

Automatic Dicing Saw DAD3350 仕様 ご使用条件 •大気圧露点-10～-20 ℃、残留油分0.1 ppm、濾過度0.01 μm/99.5％以上のクリーンな空気を使用してください。

  Dicing

Laser Application - DISCO Corporation

Laser Application Ablation Process DAL7020 DFL7020 DFL7161 DFL7160 Stealth Dicing DFL7341 DFL7360FH DFL7361 Laser Lift Off DFL7560L

  Stealth, Stealth dicing, Dicing

Resin Bond Blades R07sERIES - disco.co.jp

BB101 Current BB101 Current Resin Bond Blades R07SERIES 仕様 2014.12 実験データ Workpiece Blade Spindle revolution Feed speed Size ：Borosilicate glass 0.7 mmt

  Bond

Laser Application - Disco Corporation

What is a Hasen cut? Linear processing can be combined to enable processing of hexagonal, octagonal, and other polygonal shapes. In a Hasen cut, the laser can be turned on and off at any point to process workpieces with …

  Applications, Laser, Laser applications

Fully Automatic In-Feed Surface Grinder …

Fully Automatic In-Feed Surface Grinder DFG8540/8560 Specifications Safe wafer handling with the thin wafer robot pick Environmental conditions • Use clean, oil-free air at a dew point of -15 ℃or less.

  Surfaces, Automatic, Feed, Fully, Grinder, Fully automatic in feed surface grinder

VT07/12SERIES - disco.co.jp

www.disco.co.jp Vitrified Bond Blades VT07/12SERIES 仕様 2014.11 砥粒種類 SD B ボンド VC100 VC200 集中度 50 75 100 125 150 特殊仕様 外径 厚さ A1 ±0.002

  Docsis

Electroformed Bond Hub Blades ZH05SERIES - …

www.disco.co.jp θ θ θ θ θ θ Electroformed Bond Hub Blades ZH05SERIES 仕様 2014.11 ZH05 -SD 2000 -N1 -110 -A**** D D ×60 E 砥粒種類 SD 1500 #1500

  Bond

Fully automatic processing of thin wafers - DISCO …

www.disco.co.jp DFM2700 DFM2700 Operation flow [1] Workpiece reception from the grinder or the cassette loaded at [1]‘. [2] Workpiece transfer to …