Transcription of Laser Application - DISCO Corporation
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Laser Application - DISCO Corporation
Laser ApplicationAblation ProcessDAL7020 DFL7020 DFL7161 DFL7160 stealth DicingDFL7341 DFL7360 FHDFL7361 Laser Lift OffDFL7560L Low-k , CoO , Si+DAF DAF Die AttachFilm SEMx200 600mm/s SEMx2000 SEMx500 80 mSEMx100 150mm/s 80 mSEMx750 30 m DAF 80 mSEMx150 100 mSEMx400 500mm/s 3 Pass 50 mSEMx100[Si ][SiC ][ SEM ][ ] 10 m DFL7020 DAL7020 GroovingDFL7161 Fullcut/DAFcut DFL7160 Kiru MEMS DFL7341 DFL7361
Laser Application Ablation Process DAL7020 DFL7020 DFL7161 DFL7160 Stealth Dicing DFL7341 DFL7360FH DFL7361 Laser Lift Off DFL7560L
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