Laser Application - DISCO Corporation

1 Laser ApplicationAblation ProcessDAL7020 DFL7020 DFL7161 DFL7160 stealth DicingDFL7341 DFL7360 FHDFL7361 Laser Lift OffDFL7560L Low-k , CoO , Si+DAF DAF Die AttachFilm SEMx200 600mm/s SEMx2000 SEMx500 80 mSEMx100 150mm/s 80 mSEMx750 30 m DAF 80 mSEMx150 100 mSEMx400 500mm/s 3 Pass 50 mSEMx100[Si ][SiC ][ SEM ][ ] 10 m DFL7020 DAL7020 GroovingDFL7161 Fullcut/DAFcut DFL7160 Kiru MEMS DFL7341 DFL7361 SD.

2 SD STEALTHDICING/ SDE SEM x200 :90 m[ ]SEM x100 :100 m[ ]GaAsSEMx500 :100 m [ ][ ]SEM x50 700 mt[ ] SEM x100 350 mt[ ]MEMS[ MEMS ] SEMx500 30mm/s 1pass :100 m Kiru MEMS DFL7360FH MEMS DFL7341 Si DFL7361 LED LED LED

3 / HogoMax x200 x200 DAL/DFL7020 DFL7160 DFL7341 Low-k TEG SEM x100 635 mt Low-k Low-k Low-K Low-K Low-k Si Cu 1 10 m Si DAF DieAttachFilm SiC SEM x100 150mm/s 1 Pass 200 mt Si Si x100 200mm/s 1 Pass 50 mt SiC SEMx300 140mm/s 1 Pass 100 mt[GaAs]

4 DAF DAF Si DAF SEMx750 30 m DAF 10 m LED Cu Cu x100[Cu] HasenCut Hasen Cut DBG DAF DBG+DAF DBG DAF Hasen Cut HasenCut Hasen DBG dicing Before Grinding chipping DBG+DAF DBG DAF DAF DAF DBG DAF SiP DBG DBG.

5 DBG DAF SEM SEMx500 200mm/s Si 70 mtDAF 20 mt HogoMax003 , HogoMax HogoMax003 HogoMax003 HogoMax UV HogoMax003 HogoMax DFL7020 DFL7161 DFL7160 Laser Lift OffLaser Lift Off Laser Lift Off ?

6 ( ) 1/3 Laser Lift Off DFL7560L LED Laser Lift Off 428576 US6071795 US6420242 LED LaserLiftOff Laser Lift Off LED GaN( ) DFL7020 DFL7161 DFL7160 DFL7560 LOperation FlowDFL7341 DFL7360 FHAblation ProcessStealth DicingDFL7361 Framepickarmmovesworkpieceoutofcassette Aftercentering,theworkpieceistransferred tothecoatingtable Protectivefilmcoating Upperarmmovesworkpiecetochucktable laserprocessing Lowerarmmovesworkpiecetospinnertable cleaning Framepickarmreturnsworkpiecetocassette Framepi ckarmmov esworkpieceoutofcassettetoprealignmentst age Aftercenteringatpre-alignmentstage.

7 Upperarmmovesworkpiecetochucktable laserprocessing Lowerarmmovesworkpiecetospinnertable cleaninganddrying Upperarmmovesworkpiecetopre-alignmentsta ge Framepickarmreturnsworkpiecetocassette Frame pick arm moves workpiece out of cassette to pre-alignment stage HogoMax coating After centering at pre-alignment stage, the handling arm transfers the workpiece to the chuck table Laser processing Handling arm transfers the workpiece to the pre-alignment table cleaning Frame pick arm returns workpiece to cassette Framepickarmmovesworkpieceoutofcassettet opre-alignmentstage Aftercenteringatpre-alignmentstage,upper armmovesworkpiecetochucktable laserprocessing Lowerarmmovesworkpiecetopre-alignmenttab le FramepickarmreturnsworkpiecetocassetteWa fer transfer (Standard specification)

8 The workpiece is withdrawn from the cassette by the wafer pick and transferred to the load table The workpiece is transferred to the chuck table by the rotation arm Laser processing The workpiece is transferred to the unload table by the rotation arm The workpiece is returned to the cassette by the frame pick Unloadworkpiecefromcassettetoupperarm TransferworkpiecetoC/TwithUpperarm laserprocessing TransferworkpiecefromC/Ttorobotpickwithl owerarm RobotpickreturnsworkpiecetocassetteLaser Lift-off Frame pick arm moves workpiece out of cassette to pre-alignment stage After centering, the handling arm transfers workpiece to chuck table Laser processing Handling arm transfers workpiece to pre-alignment table Frame pick arm returns workpiece to cassette7000 SeriesSpecifications Useclean,oil-freeairatadewpointof-15 Corless.

9 ( ). Keeproomtemperaturefluctuationswithin 1 Cofthesetvalue.(Setvalueshouldbe20-25 C) ,heat-generatingequipment,oroilmistgener atingparts.* *Allthepressuresaredescribedusingapressu regauge. Avoideyeorskinexposuretodirectorscattere dlaserlight. Donotplaceshinyobjectssuchasmetalsinthel aserpath. TheabovesevenmodelscorrespondtoaClass4la serunderCDRHorIECstandardsbutmeetsafetys tandardssothattheycanbeusedasaClass1lase rproduct(CDRH:21 CFR1040,PerformanceStandardsforLaserProd uctsSource, :LaserProductSafetyPart1) Beforeusingthemachine,thoroughlyreadthem anualandfollowtheinstructionssetforthint hemanual. ConditionsLaser SafetyDFL7020 DAL7020 DFL7161 DFL7160 Fully automaticAutomaticmm 150 150 300 300 Processing rangemm155155310310 Max.

10 - - - - 600 Processing rangemm162162310310 Index (Single error) (Single error) (Single error) (Single error) -axis(Chuck table) (standard)380(option)380mm1,050 1,530 1,650600 1,500 1,5301,560 1,550 1,8001,200 1,550 1, , 2, ,750 Machine weightProcessing methodAblationWorkpiece sizeY-axis(Chuck table)Z-axisMachine dimensions(W D H)Fully automaticX-axis(Chuck table)DFL7341 DFL7360 FHDFL7361mm 200 300 300 Processing rangemm210310310 Max. processingspeedmm/sec1 1,0001 1, - 1,000 Processing rangemm210310310 Index (Single error) (Single error) (Single error) -axis(Chuck table) 1,732 1,8001,100 2,100 1,9901,210 3,270 1,800kgApprox.