Transcription of Fully Automatic In-Feed Surface Grinder …
1 DFG8540/8560 Fully Automatic In-Feed Surface GrinderAdvanced thinning power for large wafersGrinderofchoiceTheDFG8540 (<100 m) 'sDicingBeforeGrinding(DBG)systemaswella spolishers(DFP8140/8160) grinding qualityThrough innovations in equipment design, both spindles now grind wafers at the same relative position. This improves single wafer thickness variation as well as wafer to wafer thickness the same proven technology of DISCO s 800-series grinding wheels, spindles, chuck tables and dresser panelLCD touch screenDFG8560 Easy operationThe DFG8540/8560 utilizes an LCD touch screen graphicaluser interface, making operation and maintenance intuitive Automatic In-Feed Surface GrinderDFG8540/8560 SpecificationsSafe wafer handling with the thin wafer robot pickEnvironmental conditions Use clean, oil-free air at a dew point of -15 Cor less.
2 (Use a residual oil: ppm. Filtration ratin g: % or more). Keep room temperature fluctuations within 1 Cof the set value. (Set value should be between 20 -25 C). Keep grinding water and cleaning water + 0 -2 Cabove room temperature (fluctuations within 1 Cover one hour). Keep spindle cooling water temperature between 20 -25 C(fluctuations within 2 Cover an hour). The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts. This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.* All the pressures are described using gauge pressure.
3 * The above specifications may change due to technical modifications. Please confirm when placing your order.* For further information please contact your local sales 8"( 4"/5"/6"/8") 300 200/ 300 -mm 200( 8")Diamond wheel 300 Diamond ,000 7,0001,000 4,000 Thicknessvariationwithin onewafer or less (withdedicatedchuck table) or less with dedicatedchuck table, 300mm wafer Thicknessvariationbetweenwafers mFinishedsurfaceroughness mmm1,200 2,670 1,8001,400 3,322 1, , ,000In- feed grinding with wafer RotationSpindleRated outputRated torquerangeGriding wheelsGrindingAccuracy or lessBGRy (with #2000 finish)Ry (with #1400 finish)SpecificationWafer diameterGrinding methodMachine weightMachinedimensions(W D H)
