Transcription of VT07/12SERIES - disco.co.jp
1 VT07/12 SERIES Vitrified Bond Blades VT07/12 SiC SiC SiC SiC VC100 VC200 VT12VC400 SiC VT07 Chipping Avg.: 16 mChipping Avg.: 24 mTopSideVT12 Current Bond BladesVT07/12 SERIES SDB VC100VC200 5075100125150 A1 (mm) L 1 VT07 VC200 VT07 VT12 mm min-1 min-1 ,00038, ,00025, ,00019,000 1.
2 2. 3. BBD 4. CCS VT12 - SD 400 VC400 - 120 - A** SDB VC400 100120140160180 A1 (mm) 280#2801000#1000320#3201200#1200340#3401 500#1500360#3602000#2000400#4002500#2500 600#6003000#3000800#800VC200 VC10054 A2 40240#2401000#1000280#2801200#1200320#32 01500#1500340#3402000#2000360#360400#400 600#600800#800
3 WorkpieceBlade Spindle revolutionSize Sapphire mmt VT07-SD400-VC100-150G1A851 SDC240R13B01 15,000 min-1 56 x x 40 mmWorkpieceBlade Blade sizeFeed rateDepthSpindle revolution Si VT07-SD2000-VC200-100B1A801 SD2000N100M42P1A862 SD1200N100BR16 58 x 1 x 40 mm 5 degree/s mm into Si wafer Vitrified bond 20,000 min-1 Resin/Metal bond 30,000 min-1 1 VT07 VT07 - SD 400 - VC100 - 75 - A**54 A3 40 - L
