MEPTEC 2017 SEMICONDUCTOR PACKAGING …

SPRING 2011 MEPTEC Report THIS ISSUE18 Advanced packag-ing industry s first movers, competitive advantage, and dis-ruptive Heterogeneous Integration Roadmap has accomplished a great deal in the first 67th ECTC lived up to its reputation as the premium international event of the microelec-tronics PACKAGING Quarterly Publication of the Microelectronics PACKAGING & Test Engineering CouncilVolume 21, Number 3 FALL 201730Do MEMS work for you? Yes, of course. You use them every day when you use your phone, drive your car, and look at your TECHNOLOGY BRIEFSIBM Zurich researchers have developed a tiny redox flow battery. Future computer chip stacks, in which individual chips are stacked to save space and energy, could be supplied with electrical power and cooled at the same time with these integrated flow batteries. page 23++Where is the SEMICONDUCTOR Manufacturing Sweet Spot? page 12 SEMICONDUCTOR PACKAGINGSYMPOSIUMHETEROGENOUS INTEGRATION THE ROAD TO IMPLEMENTATION Thursday, November 30, 2017 - San Jose, CA page 11 MEPTEC 2017 HETEROGENOUS INTEGRATION THE ROAD TO IMPLEMENTATION Thursday, November 30, 2017 - San Jose, CA page 11 Where is the SEMICONDUCTOR Manufacturing Sweet Spot?

SPRING 2011 MEPTEC Report 3-Corp. INSIDE THIS ISSUE 18 Advanced packag-ing industry’s first movers, competitive advantage, and dis …

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