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MICRO MACHINING PROCESSES

1 WELCOME TO THE COURSEONMICRO MACHINING PROCESSESBYDr. ENGINEERING DEPARTMENT KANPUR-208016e-mail : , mechanical Engineering Department, Kanpur2 ORGANISATION TEXT BOOKS CHAPTERS TO BE COVERED IN THIS COURSE ON MMPs WHY DO YOU NEED MMPs CLASSIFICATION OF MMPs EVOLUTION AND WORKING PRINCIPLES OF SOME AMPs APPLICATIONS OF MMPs CONCLUSIONSProf. , mechanical Engineering Department, KanpurProf. , mechanical Engineering Department, Kanpur3 ADVANCED MACHINING PROCESSESProf. , mechanical Engineering Department, Kanpur4 Grading PolicyMid Sem. Exam--> 30 %End Sem. Exam 40 %Term Paper 15%Lab. Visits 05%Attendance 05%Quizzes(unannounced)-- 05%For getting D or better grade, one should have minimum 30 % marksin both theory exams (Mid Sem. + End Sem.) and 35 % in total. For getting E ,One should have 25 % in theory and 30 % in BOOKSProf. , mechanical Engineering Department, Kanpur INTRODUCTION TO MICROMACHINING , (EDITOR) PUBLISHED BY NAROSA PUBLISHERS, N EW DELHI (2009).

Fig: Chemo mechanical Polishing (CMP) Ref: T.H. Tsai et al. (2003) Prof. V.K. Jain Dept. Of Mechanical Engineering IIT Kanpur. 46 MAF AFM MRAFF MRF CMP MFP Workpiece F t F n Media Abrasiv e S N Spindle Ceramic balls Drive Shaft Al Base Steel yoke Magnetic Fluid & Abrasives Float Magnets S N S N N S N S N S Electromagnet pole Motion N S ...

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  Mechanical, Polishing, Mechanical polishing

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