Transcription of ˘ˇˆ - MicroChem
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˘ˇˆ - MicroChem
High aspect ratio imaging with near verticalside wallsNear UV (350-400nm) processingFilm thicknesses from 1 to >200 m withsingle spin coat processesSuperb chemical and temperatureresistanceSU-8 is a high contrast, epoxy based photoresist designedfor micromachining and other microelectronic applications,where a thick chemically and thermally stable image is de-sired. The exposed and subsequently cross-linked portionsof the film are rendered insoluble to liquid developers. SU-8 has very high optical transparency above 360nm, whichmakes it ideally suited for imaging near vertical sidewallsin very thick films.
Figure 1. Spin speed vs. thickness curves for selected SU-8 resists. Soft Bake After the resist has been applied to the substrate, it must be soft baked to evaporate the solvent and densify the film.
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