Transcription of ˘ˇˆ - MicroChem
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˘ˇˆ - MicroChem
High aspect ratio imaging with near verticalside wallsNear UV (350-400nm) processingFilm thicknesses from 1 to >200 m withsingle spin coat processesSuperb chemical and temperatureresistanceSU-8 is a high contrast, epoxy based photoresist designedfor micromachining and other microelectronic applications,where a thick chemically and thermally stable image is de-sired. The exposed and subsequently cross-linked portionsof the film are rendered insoluble to liquid developers. SU-8 has very high optical transparency above 360nm, whichmakes it ideally suited for imaging near vertical sidewallsin very thick films. SU-8 is best suited for permanent appli-cations where it is imaged, cured and left in GuidelinesSU-8 is most commonly processed with conventional nearUV (350-400nm) radiation, although it may be imaged withe-beam or x-ray.
Expose SU-8 is optimized for near UV (350-400nm) exposure. i-line exposure tools are recommended. SU-8 is virtually transparent and insensitive above 400nm but has high ac-
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