Transcription of Microelectronics Reliability: Physics-of-Failure Based ...
{{id}} {{{paragraph}}}
National Aeronautics and Space Administration Microelectronics reliability : Physics-of-Failure Based Modeling and Lifetime Evaluation Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-5 2/08. National Aeronautics and Space Administration Microelectronics reliability : Physics-of-Failure Based Modeling and Lifetime Evaluation NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance Mark White Jet Propulsion Laboratory Pasadena, California Joseph B.
National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation NASA Electronic Parts and Packaging (NEPP) Program
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
JEDEC Publication, FAILURE, Models, SEMICONDUCTOR, Reliability, Reliability Models to Predict Engineering, Reliability Models to Predict Engineering Systems 'Failures and, THERMAL IMAGING FOR, SCIENCE APPLICATIONS, Fiberoptic Link Model Fiberoptic Transmitter, TI Space Products, Texas Instruments TI Space Products