Transcription of Microelectronics Reliability: Physics-of-Failure Based ...
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Microelectronics Reliability: Physics-of-Failure Based ...
National Aeronautics and Space Administration Microelectronics reliability : Physics-of-Failure Based Modeling and Lifetime Evaluation Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-5 2/08. National Aeronautics and Space Administration Microelectronics reliability : Physics-of-Failure Based Modeling and Lifetime Evaluation NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland NASA WBS: JPL Project Number: 102197.
Acronyms vi FaRBS Failure Rate Based SPICE FPGA Field Programmable Gate Array FIT Failure in Time FN Fowler-Nordheim GCA Gradual Channel Approximation
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