Transcription of 'MicroStar BGA Packaging Reference Guide' - TI.com
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'MicroStar BGA Packaging Reference Guide' - TI.com
microstar BGA PackagingReference GuidePrinted on Recycled PaperPrinted on Recycled PaperLiterature Number: SSYZ015 BThird Edition September 2000 microstar BGA is a trademark of Texas Instruments NOTICET exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgment, including thosepertaining to warranty, patent infringement, and limitation of warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty.
MicroStar BGA Packaging Reference Guide iii Introduction The parallel pursuit of cost reduction and miniaturization in recent years has given rise to an increasing emphasis
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