Transcription of 'MicroStar BGA Packaging Reference Guide' - TI.com
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'MicroStar BGA Packaging Reference Guide' - TI.com
microstar BGA PackagingReference GuidePrinted on Recycled PaperPrinted on Recycled PaperLiterature Number: SSYZ015 BThird Edition September 2000 microstar BGA is a trademark of texas instruments NOTICET exas instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgment, including thosepertaining to warranty, patent infringement, and limitation of warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI s standard warranty.
iv MicroStar BGA Packaging Reference Guide Texas Instruments addressed several key issues in package assembly in order to produce a CSP that is not
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