Transcription of MODUL R - Amphenol Ltd
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MODUL RBoard to Board & Board to Harness Interconnect people + technologyAmphenol Board Level Interconnect products2 Table of Contents About Amphenol ..3 Quick selection guide ..6 Amphenol High-speed technology ..8 Amphenol RADSOK technology ..9 Amphenol thermal management mastering ..10 MODUL R : why does the commercial avionics market need for modular architecture ? ..12 MODUL R scalability to infinite adaptability ..13 MODUL R product range ..14 General specifications ..15 Technical specifications ..16 Board-to-harness interconnect ..176U & 3U compliance ..186U dimensional characteristics ..19 Signal module ..21 High speed module ..22 power module 10A ..23 power module 36A ..24 power module 70A ..25 Bonding module ..26 Dummy module ..27 Keying ..29 Guiding.
PAGE 22 Amphenol • Board Level Interconnect products 7 POWER MODULES > Power module range to fulfill all the power needs 10A 36A 70A PAGE 23 PAGE 24 PAGE 25 BONDING MODULE
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High-power-density Inverter Technology for, High-power-density Inverter Technology for Hybrid, Applications, Power, For automotive, Performance and Reliability Characteristics of, Power applications, Module, Designing the front-end DC, Texas Instruments, Automotive Designing the front-end DC, Conversion stage to withstand automotive, HARTING Connectors High Mating Cycles, Call for Papers, Automotive, Way in Reliable System Solutions, Eaton, DLP Technology and Products