Transcription of Moisture-sensitive Components T
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Moisture-sensitive Components T
ROBERT ROWLANDhe topic of Moisture-sensitive Components is rather boring but very important andfrequently misunder-stood. Increased mois-ture- sensitive compo-nent use, such as thin fine-pitchdevices and ball grid arrays (BGA),has increased concern for this fail-ure mechanism. When compo-nents are exposed to the elevatedtemperatures that occur duringreflow soldering, moisture trappedinside plastic surface mountdevices (SMD) produces enoughvapor pressure to damage ordestroy the device. Common fail-ure modes include internal sepa-ration (delamination) of the plas-tic from the die or lead-frame;wire bond damage; die damage;and internal cracks that do notextend to the component extreme cases, cracks willextendto the component surface; in themost severe cases, the componentwill bulge and pop (referred toas the popcorn effect).
ROBERT ROWLAND he topic of moisture-sensitive components is rather boring but very important — and frequently misunder-stood. Increased mois-ture-sensitive compo-
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