Transcription of Orchestrating Packaging Technologies for an Extra …
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Orchestrating Packaging Technologies for an Extra sensory WorldJean-Marc YannouChristophe ZinckEddie ChengVincent K. LiaoAlex ChanNicole Group ASE Group. All rights throughout this presentation1 Supply chainSystem-in-a-PackageDesign, Manufacturing, Packaging and testMEMS & SensorsIntegrationThe Internet of Things Development kitStandardizationMotionEnvironmentalsen sors ASE Group. All rights IoT: integration a building block development kit cost and small size with SiPand advanced MEMS packaging2 ASE Group. All rights Internet of Things : perspectivesThe next big thing in the industry?Courtesy of Cisco ASE Group. All rights UnitsMainframeMillions UnitsPC (PM)350M+ UnitsCell Phone (PP) + UnitsSmartComputing (PMP)10B+ UnitsInternet of Things (IOT) (PMMP)100B+ UnitsExponential Connectivity & Big Data 1970s1980s1990s2000s2010sLong TailWe are hereVolume Paradigm: 10X in 10Y, accelerating2020s4 ASE Group. All rights is a not a market, it s a tech trendCourtesy of Beecham Research ASE Group.
Orchestrating Packaging Technologies for an Extra Sensory World Jean-Marc Yannou Christophe Zinck Eddie Cheng Vincent K. Liao Alex Chan Nicole Tien
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