Transcription of PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS
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PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS
This version:Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION1. PACKAGE CLASSIFICATIONSThis document is Chapter 1 of the PACKAGE INFORMATION document consisting of 8 chapters INFORMATION1. PACKAGE CLASSIFICATIONS11. PACKAGE TrendsIn recent years, marked advances have been made in the electronics field. One such advance has been theprogression from vacuum tubes to transistors and finally, to ICs. ICs themselves have been more highlyintegrated into LSIs, VLSIs, and now, increased functions and pin counts, IC packages have had to change significantly in the last few years inorder to keep-up with the advancement in semiconductor required for conventional IC packages are as follows:1)To protect IC chips from the external environment2)To facilitate the packaging and handling of IC chips3)To dissipate heat generated by IC chips4)To protect the electrical characteristics of the ICStandard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage in theel
L-Leaded Package SOP packages are characterized by gull-wing type leads which are drawn out from each package body in two directions, and can be mounted flat. The standard lead pitch is 1.27 mm (50 mil). Shrink Small Out-line L-Leaded Package SOP packages with a lead pitch of less than 1.27 mm (50 mil) are called SSOP. Thin Small Out-line L ...
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