Transcription of Package Information Datasheet for Altera Devices
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Package Information Datasheet for Altera Devices
December 2011 Altera CorporationPackage Information Datasheet for Mature Altera DevicesPackage Information Datasheet forMature Altera DevicesThis Datasheet provides Package and thermal resistance Information for matureAltera Devices . Package Information includes the ordering code reference, packageacronym, leadframe material, lead finish (plating), JEDEC outline reference, leadcoplanarity, weight, moisture sensitivity level, and other special Information . Thethermal resistance Information includes device pin count, Package name, andresistance Datasheet includes the following sections: Device and Package Cross Reference on page 1 Thermal Resistance on page 23 Package Outlines on page 44fFor more Package and thermal resistance Information about Altera Devices that arenot listed in this Datasheet , refer to thePackage and Thermal Resistancepage of theAltera Information about trays, tubes, and dry packs, refer toAN 71: Guidelines forHandling J-Lead, QFP, and BGA Devices are compatible with leaded-reflow temperatures.
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Package Information Datasheet for Mature Altera Devices
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