Transcription of PACKAGE QUALIFICATION SUMMARY REPORT
{{id}} {{{paragraph}}}
Example: air traffic controller
PACKAGE QUALIFICATION SUMMARY REPORT
PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: ML1120110066 Purpose: To provide QUALIFICATION SUMMARY REPORT for all packages Device: Various Mask Identification #: Various Process Technology: Pure Matte Tin (Sn) Plating Process 400 in (10 m) 1000 in (25 m), Pre-Plated Leadframe (PPF), or SnAgCu based solder bump Product: Various devices plated with Matte Tin, PPF, or with solder spheres Updated: May 18, 2017 PACKAGE QUALIFICATION SUMMARY REPORT DOCUMENT CONTROL # ML1120110066 Microchip Technology Inc. 2 PACKAGE QUALIFICATION SUMMARY REPORT CONTENTS 1) QUALIFICATION OVERVIEW 2) RELIABILITY TEST DESCRIPTIONS 3) QUALIFICATION RESULTS & RELEASE STATUS 4) CONCLUSION RESULTS SUMMARY The assembly using Matte Tin plating, PPF or solder spheres complies with the reliability guidelines documented in the QUALIFICATION plan.
May 18, 2017 · Package Qualification Summary Report DOCUMENT CONTROL # ML1120110066 Microchip Technology Inc. 3 1 QUALIFICATION OVERVIEW The purpose of this report is to verify that the qualification testing was performed in accordance with the documented qualification plan required by Microchip specification QCI-39000-002, “Worldwide Quality
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: