Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q102 - Rev A April 6, 2020 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR OPTOELECTRONIC SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q102 - Rev A April 6, 2020 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q102 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Optoelectronic Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: AEC-Q102 Certification of Design, Construction and QUALIFICATION Appendix 3: AEC-Q102 QUALIFICATION Test Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements and FAILURE Criteria Appendix 6: Destructive Physical Analysis (DPA) Appendix 7: AEC-Q102 and the Use of Mission Profiles Appendix 7a: Reliability Validation for Optoelectronic Semiconductors Attachments AEC-Q102-001: DEW TEST (DEW) AEC-Q102-002: BOARD FLEX TEST (BF) AEC-Q102-003: OPTOELECTRONIC MULTICHIP MODULES (This attachment is not released at the time of the release of the AEC-Q102 Rev A main)
conditions for qualification of optoelectronic semiconductors (e.g., light emitting diodes, photodiodes, laser components (see Figure 1a & b)) in all exterior and interior automotive applications. It combines state of the art qualification testing, documented in various documents (e.g., JEDEC, IEC, MIL-STD) and manufacturer qualification standards.
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