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Part II How to Design and Build Working Electronic Circuits

2005 Hongshen Ma Part II How to Design and Build Working Electronic Circuits By Hongshen Ma 2005 Hongshen Ma Important note: This document is a rough draft of the proposed textbook. Many of the sections and figures need to be revised and/or are missing. Please check future releases for more complete versions of this text. 2005 Hongshen Ma Outline Part II How to Design and Build Working Electronic Circuits 11 Reading Datasheets 12 Electronic Packaging Through-Hole Surface Mount Ball Grid Array Comparing Packaging Technologies 13 Specifications of Discrete Components Resistors Capacitors Ceramic Capacitors Electrolytic Capacitors

18.6.4 Prepackaged Power Drivers 19 Comparators and Analog-to-Digital Converters 19.1 Comparators 19.2 ADC Specifications ... op amps can only be so fast, and transistors can only ... offering low-cost, low-volume prototype runs, it is easier to skip the solderless

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