PCB Fabrication Processes Brief Introduction - …

PCB FabricationProcessesBrief IntroductionOrig2004/08/21 Edit2011/01/04 ContentsPCB Processes Flow Chart ..(001) Layer Processing ..(002) Lamination ..(032)7 ..(058)10 Plating ..(071)11 Layer (102)136. 1. Solder Mask ..(123)15 6. 2. Silk Screen ..(147)17 7. 1. Gold Finger Plating ..(158)18 7. 2. HASL ..(173)20 7. 3. Routing ..(190)21 Test & FQC ..(205)22 PCB FabricationProcesses Brief Introduction3D/S BoardLaminationENIG G/F PlatingHASL PackingShippingM/L s I/L manufactureHASLF inal Finish according to customer requirementDrillingCopper PlatingOuter LayerSolder MaskSilk ScreenE-Test & FQCOQCE ntek OSPI mmersion AgOQCE-Test& FQCR outingI/L CuttingPCB Processes Flow Chart4 RoutingG/F PlatingEntek OSP or Immersion Silver should be applied afterFQCI nner Layer ProcessingBase materials before cuttingBase materials after cuttingStack panels and send to next processBefore bevelingAfter beveling1-3 Pre-treatmentBrush foreign materials away from board surfaceAfter pre-treatment brushing1-4 Roller CoatingBefore roller coatingRoller coatingAfter roller coatingDouble sided send to drilling Multi-Layer send to inner layer pre-treatment 1-1 Cutting1-2 BevelingI/L Flow1-1 Cutting1-2 Beveling1-4 Roller Coating1-5 Exposure1-6 DES Line1-7I/L holes1-3 Pre-treatment51-5 ExposureExposureBoard surface

Mass Lamination Process 2-1 Brown Oxide Inner layer surface before brown oxidation Inner layer surface after brown oxidation 2-2 Pre Lay-up Cut prepreg before pre-layup

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