Transcription of 공정1: 내층 I (재단, 내층노광/현상/부식/박리)
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공정1: 내층 I (재단, 내층노광/현상/부식/박리)
1 : I( , / / / )1. Core CCL( ) 407mm x 510mm(6/J) 406mm x 457mm(4/R) , SawingMachine .2. Core CCL Lamination Dry Film Working Film<Negative( ) Film> , Intensity( ) Time( ) Energy Dry Film Monomer( ) Polymer( ) Pattern Image .3. Polymer( ) Dry Film , Monomer( ) Chemical(Na CO ) . Chemical , , Conveyor Spray .4. Core CCL Dry Film , Pattern (Acid-Etchant : : CuCl , FeCl ) , DFR Dry Film Resist 1 5% NaOH KOH ( )/ .1. Core CCL( ) 407mm x 510mm(6/J) 406mm x 457mm(4/R) , SawingMachine.
공정2 :내층II (BONDING, LAY-UP, PRESS LAMINATION) 1. Bonding (본딩) 레이업(적층) 작업을위해1차로내층회로가형성된 Thin Core CCL을Prepreg(층간접착제)와하나로맞붙이는
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