공정1: 내층 I (재단, 내층노광/현상/부식/박리)

1 1 : I( , / / / )1. Core CCL( ) 407mm x 510mm(6/J) 406mm x 457mm(4/R) , SawingMachine .2. Core CCL Lamination Dry Film Working Film<Negative( ) Film> , Intensity( ) Time( ) Energy Dry Film Monomer( ) Polymer( ) Pattern Image .3. Polymer( ) Dry Film , Monomer( ) Chemical(Na CO ) . Chemical , , Conveyor Spray .4. Core CCL Dry Film , Pattern (Acid-Etchant : : CuCl , FeCl ) , DFR Dry Film Resist 1 5% NaOH KOH ( )/ .1. Core CCL( ) 407mm x 510mm(6/J) 406mm x 457mm(4/R) , SawingMachine.

2 2. Core CCL Lamination Dry Film Working Film<Negative( ) Film> , Intensity( ) Time( ) Energy Dry Film Monomer( ) Polymer( ) Pattern Image .3. Polymer( ) Dry Film , Monomer( ) Chemical(Na CO ) . Chemical , , Conveyor Spray .4. Core CCL Dry Film , Pattern (Acid-Etchant : : CuCl , FeCl ) , DFR Dry Film Resist 1 5% NaOH KOH ( )/ .1. 1. 2. 2. 3. 3. 4. 4. 2 : II (BONDING, LAY-UP, PRESS LAMINATION)1. Bonding ( ) ( ) 1 Thin Core CCL prepreg ( ).

3 2. Lay Up ( = ) prepreg (Bonding Material : ) Mass Lamination(6 Rivet ) Pin Lamination .3. Press Lamination ( ) , , Cooling .Press , , prepreg Glass Weave Type, Resin Flow Rate, Resin Content, Gel Time, Tg Point, Volatile Content .1. Bonding ( ) ( ) 1 Thin Core CCL prepreg ( ) .2. Lay Up ( = ) prepreg (Bonding Material : ) Mass Lamination(6 Rivet ) Pin Lamination .3. Press Lamination ( ) , , Cooling.

4 Press , , prepreg Glass Weave Type, Resin Flow Rate, Resin Content, Gel Time, Tg Point, Volatile Content .2. Lay-Up ( )2. Lay-Up ( )1. Bonding ( )1. Bonding ( )3. Press Lamination ( )3. Press Lamination ( ) 3 : I ( , , STACK)1. CCL( ) 407mm x 510mm(6/J) 510mm x 610mm(4/J) , Sawing-Machine ..- Foreign Material ( )-Warp ( )-PIT ( )- DENT ( )- Scratch ( , )- 2. ( ) Panel Copper Foil( ),Glass Fiber( ) Epoxy Resin( ) .3. Stack Panel Panel .1. CCL( ) 407mm x 510mm(6/J) 510mm x 610mm(4/J) , Sawing-Machine.

5 - Foreign Material ( )-Warp ( )-PIT ( )- DENT ( )- Scratch ( , )- 2. ( ) Panel Copper Foil( ),Glass Fiber( ) Epoxy Resin( ) .3. Stack Panel Panel .1. 1. 3. Stack3. Stack2. ( )2. ( ) 4 : II (DRILL, DRILL BIT)1. Drill ( ) Hole Edit( ) X-Y Coordinates CNC(Computer Numerical-Control) Working Panel ..1) X-Y Data2) Drill Bit ( )3) Aluminum Entry Foil4) Bakelite Back-up Board5) Drill Parameter (RPM/sfm/Chip Load)2. Drill Bit ( ) PCB Drill Bit PCB . (WC = Tungsten Carbide) (Co = Cobalt) , Tic, Ta, Nb.

6 Drill Bit .1) Critical Defects ( ) -Chips -Layback 2) Major Defects ( )-Overlap-Offset3) Minor Defects ( )- Gap -Negative- Flair - Hook1. Drill ( ) Hole Edit( ) X-Y Coordinates CNC(Computer Numerical-Control) Working Panel ..1) X-Y Data2) Drill Bit ( )3) Aluminum Entry Foil4) Bakelite Back-up Board5) Drill Parameter (RPM/sfm/Chip Load)2. Drill Bit ( ) PCB Drill Bit PCB . (WC = Tungsten Carbide) (Co = Cobalt) , Tic, Ta, Nb .Drill Bit .1) Critical Defects ( ) -Chips -Layback 2) Major Defects ( )-Overlap-Offset3) Minor Defects ( )- Gap -Negative- Flair - HookDrill ( )Drill ( ) 5 :PHOTO ( , LAMINATION, , )1.

7 Scrubbing ( : ) , Dry Film .2. Lamination ( ) Panel Dry Film (Photo Sensitive Dry Film-Resist : ) . 3. Panel Lamination Dry Film Working Film Intensity Time( ) Energy Monomer( ) Polymer( ) Pattern Image .4. Polymer( ) , Monomer( ) Chemical (Na CO ) . 1. Scrubbing ( : ) , Dry Film .2. Lamination ( ) Panel Dry Film (Photo Sensitive Dry Film-Resist : ) . 3. Panel Lamination Dry Film Working Film Intensity Time( ) Energy Monomer( ) Polymer( ) Pattern Image .4. Polymer( ) , Monomer( ) Chemical (Na CO ).

8 1. Scrubbing ( )1. Scrubbing ( )2. Lamination2. Lamination3. 3. 4. 4. 6 : I( )1. (Electroless Copper Plating) (= ) Chemical( ) Catalyst( ) Hole PTH(Plated Through Hole) Panel Panel Plating . - , Pd .- Metal Deposition( ) Chemical Oxidation / Reduction Reaction( / ) , .- Hole(Through-Hole) Coating , ( : Panel or Pattern ) .1) Light Copper : 2) Medium Copper : 3) Heavy Copper : 1. (Electroless Copper Plating) (= ) Chemical( ) Catalyst( ) Hole PTH(Plated Through Hole) Panel Panel Plating.

9 - , Pd .- Metal Deposition( ) Chemical Oxidation / Reduction Reaction( / ) , .- Hole(Through-Hole) Coating , ( : Panel or Pattern ) .1) Light Copper : 2) Medium Copper : 3) Heavy Copper : 1. Soft Etching1. Soft Etching2. Conditioner2. Conditioner3. Catalyst3. Catalyst 7 : II ( , )1. (Electro Copper Plating) Pattern Hole (Electro-Deposition) 2 .2. (Electro Solder Plating) (Pattern) Hole (Electro Deposition) (Etching Resist) ( = 7 10 ).

10 * Solder = Tin/Lead = Sn/Pb(63 : 37) = = / = = = 3. (Etching) Panel Dry Film , Pattern (NH OH, NH Cl) . 1. (Electro Copper Plating) Pattern Hole (Electro-Deposition) 2 .2. (Electro Solder Plating) (Pattern) Hole (Electro Deposition) (Etching Resist) ( = 7 10 ).* Solder = Tin/Lead = Sn/Pb(63 : 37) = = / = = = 3. (Etching) Panel Dry Film , Pattern (NH OH, NH Cl) . 1. (Electro Copper Plating)1. (Electro Copper Plating)2. (Electro Solder Plating)2. (Electro Solder Plating)3.